Last month, I had the great honor of joining with some of my colleagues to presenting some of our work from Chipletz at DesignCon 2026. We've been doing some fascinating work in the area of advanced packaging, and we're grateful for the opportunity to share this work at such a prestigious conference.

If you're interested in advanced semiconductor packaging , die-to-die interconnects , chiplets and heterogeneous integration , or just signal integrity in general, please check out our work! Our contact information is given right in the paper and slides, so feel free to reach out with any questions.